A third‐generation circuit printing process

Abstract

This paper concerns a novel process for forming additive copper interconnect on flexible substrates via printing and plating processes. Building on the established conductive lithographic film and CLF plating seeding technologies, the described process enables low‐cost substitutes for existing flexible electronic wiring boards to be manufactured without precious metals.

Citation

Evans, P.S.A., Harrey, P.M., Harrison, D.J. and Begum, Z. (2002), "A third‐generation circuit printing process", Circuit World, Vol. 28 No. 2, pp. 9-10. https://doi.org/10.1108/03056120210412490