The contribution of thermoreflectance to high resolution thermal mapping

Abstract

Thermal phenomena that occur in operating integrated circuits can disturb their functioning and even cause failures. In order to prevent such dramatic issues, it is necessary to study these phenomena by developing high‐resolution thermal mapping of electronic devices. This can be done by using the thermoreflectance technique. The principle of thermoreflectance measurements is reviewed and various experimental setups are described. Experimental results show that this technique allows the mapping of both low and high frequency thermal phenomena at submicron scales.

Citation

Filloy, C., Tessier, G., Holé, S., Jerosolimski, G. and Fournier, D. (2003), "The contribution of thermoreflectance to high resolution thermal mapping", Sensor Review, Vol. 23 No. 1, pp. 35-39. https://doi.org/10.1108/02602280310457929