The development of a wafer prealigner based on the multi‐sensor integration

Abstract

Purpose

This paper sets out to propose a wafer prealigner based on multi‐sensor integration and an effective prealignment method implemented on it.

Design/methodology/approach

The wafer and notch eccentricities, on which wafer prealignment is based, are calculated with the peripheral data of the wafer detected by a laser displacement sensor and a transmission laser sensor by means of barycenter acquiring algorithm in a one‐particle system.

Findings

The center and notch prealignment precisions of the system are, respectively, ±1.5 μm and ±30 μrad. Experimentation has proved the validity and effectiveness of the system.

Practical implications

The wafer prealigner is a subsystem of the lithography in the semiconductor industry. The prealignment algorithm can be implemented in any object with random figures.

Originality/value

The periphery of the wafer is detected by a high‐precision laser displacement sensor and a low‐cost transmission laser sensor instead of a CCD linear sensor used by traditional wafer prealigners, which saves the space occupation of the structure and enhances the systematic prealignment precision. Using barycenter acquiring algorithm in a one‐particle system to calculate the wafer and notch eccentricities is effective and valid.

Citation

Huang, C., Cao, Q., Fu, Z. and Leng, C. (2008), "The development of a wafer prealigner based on the multi‐sensor integration", Assembly Automation, Vol. 28 No. 1, pp. 77-82. https://doi.org/10.1108/01445150810849046