Wafer prealigning robot based on shape center calculation
Abstract
Purpose
The aim of this paper is to provide a new wafer prealigning robot for the photo‐etching facility during the manufacturing of IC products.
Design/methodology/approach
The shape center is measured by a reflection‐style laser sensor in the wafer's radial direction, and the position is measured by a penetration‐style laser sensor. A dynamic error compensation is applied to eliminate the radial runout and wobble of the rotary stage, which have effects on the measurement of the wafer's shape center.
Findings
It is found that the new wafer prealigning robot can satisfy the accuracy requirement.
Research limitations/implications
The robot requires that the shape center can be accurately calculated.
Practical implications
The robot is applicable to wafer prealigning for the photo‐etching facility.
Originality/value
A wafer prealigning robot based on the shape center calculation method has been developed and is described in the paper.
Keywords
Citation
Fu, Z., Huang, C.X., Liu, R.Q., Zhao, Y.Z. and Cao, Q.X. (2008), "Wafer prealigning robot based on shape center calculation", Industrial Robot, Vol. 35 No. 6, pp. 536-540. https://doi.org/10.1108/01439910810909538
Publisher
:Emerald Group Publishing Limited
Copyright © 2008, Emerald Group Publishing Limited