The corrosion of silver in indoor conditions of an assembly process in the microelectronics industry

Abstract

Purpose

The purpose of this paper is to evaluate the corrosion of silver due to hydrogen sulphide pollutant in indoor conditions at a microelectronics plant located in Mexicali, Baja California, a semi‐arid zone in the northwest of Mexico.

Design/methodology/approach

Silver coupons and silver plated on to copper‐lead frames are exposed in the assembly process building of a microelectronics company during a period of 60 days and also in a sheltered test chamber that simulates indoor conditions with ambient concentrations of atmospheric pollutants, temperature and relative humidity (rH). Other exposures are made in the test chamber to study the corrosion behaviour of silver coupons over a duration of 24 months. The corrosion products were analysed using the Scanning Electron Microscope (SEM) and Energy Dispersive X‐ray Spectroscopy (EDS). Corrosion rates were measured by Quartz Crystal Microbalance (QCM) under laboratory‐controlled conditions.

Findings

The presence of silver sulphide corrosion products, dendrites and whiskers is observed on the exposed samples using SEM and EDS analysis.

Practical implications

The paper is designed to establish whether the company, where the exposure is taking place, constituted an indoor environment with outdoor hydrogen sulphide pollutant in sufficient concentration to induce silver corrosion.

Originality/value

The methodology used in this work can be applied to study the indoor corrosion behaviour of other metals, which will be of interest to the microelectronics industry.

Citation

Vargas, O.L., Valdez, S.B., Veleva, M.L., Zlatev, K.R., Schorr, W.M. and Terrazas, G.J. (2009), "The corrosion of silver in indoor conditions of an assembly process in the microelectronics industry", Anti-Corrosion Methods and Materials, Vol. 56 No. 4, pp. 218-225. https://doi.org/10.1108/00035590910969347